Technical overview
All technical details are verified and based on product testing.
Should you be interested in further details for your application area, please contact us with your request.
Basic standards
The development of our products is based on the following standards:
DIN 40040
Guidelines for establishing climatic and mechanical application categories for electrical components in telecommunications.
DIN 40046 and DIN IEC 68
Climatic and mechanical tests for electrical components in telecommunications.
DIN 40050 · IP protection classes.
DIN 41619
Rotary step switches for telecommunications, terms, application categories, tests.
DIN 41640
Measuring and testing procedures for electro-mechanical components.
Some of our products satisfy the following standards:
VG 0095318 T2
Electrical switches for low-frequency technology, basic regulation.
MIL-S-3786
Current issue E.
DIN 40040
Guidelines for establishing climatic and mechanical application categories for electrical components in telecommunications.
DIN 40046 and DIN IEC 68
Climatic and mechanical tests for electrical components in telecommunications.
DIN 40050 · IP protection classes.
DIN 41619
Rotary step switches for telecommunications, terms, application categories, tests.
DIN 41640
Measuring and testing procedures for electro-mechanical components.
Some of our products satisfy the following standards:
VG 0095318 T2
Electrical switches for low-frequency technology, basic regulation.
MIL-S-3786
Current issue E.
Electrical and mechanical characteristic values
The specifications on this website are characteristic values, i.e. they may be exceeded or fallen short of, provided that their influence on other characteristic values is taken into account.
Examples
The number of wafers can be exceeded for many switch types provided the impact on torque is taken into account. The necessary torque per wafer increases with the number of circuits and is generally higher in the case of non-shorting than shorting switching modes. Consequently, shorting switches with just one circuit per wafer still remain within the specified operating torque, even when more wafers are featured.
Switching power, switching current and switching voltage refer respectively to the purely resistive load and specified life cycle. Although these values may be exceeded or non-resistive loads switched, the impact on service life should be taken into account. How many switching cycles can be achieved with a specific load often has to be ascertained on the basis of tests with the original load.
Life cycle
Life cycle is specified in full switching cycles, i.e. a switching cycle consists of progressing through all switching positions and back again.
In the case of switches where life cycle is related to a limited number of switch positions, this is specified separately, e.g. by 2 x 6, i.e. life cycle is for a switch with 2 circuits and 6 switch positions. Limiting to few switch positions generally results in a longer life cycle.
Examples
The number of wafers can be exceeded for many switch types provided the impact on torque is taken into account. The necessary torque per wafer increases with the number of circuits and is generally higher in the case of non-shorting than shorting switching modes. Consequently, shorting switches with just one circuit per wafer still remain within the specified operating torque, even when more wafers are featured.
Switching power, switching current and switching voltage refer respectively to the purely resistive load and specified life cycle. Although these values may be exceeded or non-resistive loads switched, the impact on service life should be taken into account. How many switching cycles can be achieved with a specific load often has to be ascertained on the basis of tests with the original load.
Life cycle
Life cycle is specified in full switching cycles, i.e. a switching cycle consists of progressing through all switching positions and back again.
In the case of switches where life cycle is related to a limited number of switch positions, this is specified separately, e.g. by 2 x 6, i.e. life cycle is for a switch with 2 circuits and 6 switch positions. Limiting to few switch positions generally results in a longer life cycle.
Non-standard versions
Our switch range can be customised to suit specific requirements. Wafer spacing, shaft lengths and forms, operating torques and many other parameters can be changed. Please just ask us.
Detent angle
The detent angle is the rotational angle between two switch positions. The number of switch positions is calculated on the basis of:
360° ∕ detent angle
360° ∕ detent angle
Contact systems

Knife contact – Bridge contact
Switching mode
Switches can be supplied in a non-shorting or shorting (bridging) switching mode. In shorting mode, two adjacent contacts are bridged during switching. The moving contact briefly links the old and new switch positions, i.e. the two outputs are connected briefly. In non-shorting mode, the existing connection is interrupted before a new contact is made.
Switching combinations
Switching combinations are specified as follows, e.g. 2 x 6, 2 x 3 and 1 x 12, indicates the number of circuits on a wafer and the number of switch positions, so 2 x 6 denotes two circuits and six switch positions. If this switch is to be limited to four switch positions, the corresponding switching combination will be 2 x 4.
Insulating material
The most suitable insulating materials were selected for the respective switch types.
Code Designation Dl Diallyl Phthalate, DAP EP Epoxide glass laminate HP Laminated paper 2062.8 DIN 7735 NO Noryl, PPO PB Polybutylenterephthalate, PBTP PC Polycarbonate, PC PE Polyaethylenterephthalate, PETP PO Polyamide, PA PM Polyacetal, POM PS Polyphenylene sulphide, PPS RY Ryton, PPS
Contact material
Important information for selecting contact materials. Contacts are self-cleaning and require no maintenance in normal operating conditions.
Contact materials should be selected depending on the electrical and mechanical properties required of switches and taking into account environmental influences. The following materials have proved particularly successfully:
1. GOLD
a) When switching levels of <0.5 V and <0.1A.
b) When used in a corrosive atmosphere.
c) For applications in the μV- and μA-range and less frequent actuation. In this case, please contact us directly to select an appropriate switch from our range.
2. SILVER
a) When switching levels of <0.5 V and <0.1A under normal environmental circumstances.
b) For frequently actuated rotary switches.
All open contacts required to switch low voltages reliably should not be exposed to direct air circulation. They should be protected by an encapsulated design or dust caps, e.g. in the case of measuring point selectors inside equipment with internal heat sources.
Contact materials should be selected depending on the electrical and mechanical properties required of switches and taking into account environmental influences. The following materials have proved particularly successfully:
1. GOLD
a) When switching levels of <0.5 V and <0.1A.
b) When used in a corrosive atmosphere.
c) For applications in the μV- and μA-range and less frequent actuation. In this case, please contact us directly to select an appropriate switch from our range.
2. SILVER
a) When switching levels of <0.5 V and <0.1A under normal environmental circumstances.
b) For frequently actuated rotary switches.
All open contacts required to switch low voltages reliably should not be exposed to direct air circulation. They should be protected by an encapsulated design or dust caps, e.g. in the case of measuring point selectors inside equipment with internal heat sources.
Temperature range
Normal version from –25 to 85°C. Temperature limit values do not apply for continuous operation.
Non-standard types are available for other temperature ranges, e.g. switches to MIL
or VG with a permissible operating temperature of –55 °C to 85 °C and a storage temperature
of –65 °C to 125 °C.
All technical data on this website apply for a normal climate of 23 °C and 50% relative humidity. DIN 50014.
Pie-treatment for voltage and insulation tests is performed over 4 days in climate conditions of 40/93,
DIN IEC 68,Part 2–3.
Measuring voltage for insulation measuring is U =100V– ±15V, to DIN 41640.
Non-standard types are available for other temperature ranges, e.g. switches to MIL
or VG with a permissible operating temperature of –55 °C to 85 °C and a storage temperature
of –65 °C to 125 °C.
All technical data on this website apply for a normal climate of 23 °C and 50% relative humidity. DIN 50014.
Pie-treatment for voltage and insulation tests is performed over 4 days in climate conditions of 40/93,
DIN IEC 68,Part 2–3.
Measuring voltage for insulation measuring is U =100V– ±15V, to DIN 41640.
Lubrication
Our switches are adequately lubricated to achieve the reliability specified on this website. We extend no guarantee for function and service life in respect of cleaning and relubrication, as tests in our laboratory have shown that some commercially available solvents and contact lubricants can seriously impair switch function.
Important processing information
Soldering
All components listed on this website are designed for further processing to DIN IEC 68, Part 2–20. Please observe the maximum permissible temperature and time limits for the components used when pre-heating, fluxing and soldering with regard to PCB structure and assembly density. A soldering test using the planned soldering process and fully assembled PCB is recommended. In the case of manually wired miniature switches, we particularly recommend the use of non-resinous solders.
Cleaning PCBs
Switches must not be completely immersed in cleaning agents as lubricant and materials may be dissolved. The exception to this rule is washtight switches. Solvents and washing agents used should be tested individually in each case for compatibility.
All components listed on this website are designed for further processing to DIN IEC 68, Part 2–20. Please observe the maximum permissible temperature and time limits for the components used when pre-heating, fluxing and soldering with regard to PCB structure and assembly density. A soldering test using the planned soldering process and fully assembled PCB is recommended. In the case of manually wired miniature switches, we particularly recommend the use of non-resinous solders.
Cleaning PCBs
Switches must not be completely immersed in cleaning agents as lubricant and materials may be dissolved. The exception to this rule is washtight switches. Solvents and washing agents used should be tested individually in each case for compatibility.
Accessories
Accessories, e.g. washers, nuts and seals are supplied loose, separately packed, with all deliveries.
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